Concepedia
Statistics
Publications
13
Citations
545
H-Index
Active since
2005
Affiliations
Guangzhou University(Current)
University of Saskatchewan
National University of Singapore
J.W. Wan is an author at Guangzhou University specializing in engineering, chip packaging, and flip-chip packaging.
Publications per year
2005–2023
Recent advances in modeling the underfill process in flip-chip packaging
J.W. Wan, Wenjun Zhang, Donald J. Bergstrom · Microelectronics Journal · 2006 · 85 citations
Engineering, Materials Engineering, Materials Science +14
A new method of determination of indoor temperature and relative humidity with consideration of human thermal comfort
J.W. Wan, Kunli Yang, Wenjun Zhang et al. · Building and Environment · 2008 · 85 citations
Architecture, Architectural Engineering, Building Science +17
An analytical model for predicting the underfill flow characteristics in flip-chip encapsulation
J.W. Wan, Wenjun Zhang, Donald J. Bergstrom · IEEE Transactions on Advanced Packaging · 2005 · 74 citations
Engineering, Computer Engineering, Materials Engineering +15
The effect of heat-pipe air-handling coil on energy consumption in central air-conditioning system
J.W. Wan, J.L. Zhang, W.M. Zhang · Energy and Buildings · 2007 · 47 citations
Engineering, Mechanical Engineering, Air Conditioning +15
Numerical Modeling for the Underfill Flow in Flip-Chip Packaging
J.W. Wan, Wenjun Zhang, Donald J. Bergstrom · IEEE Transactions on Components and Packaging Technologies · 2009 · 42 citations
Engineering, Computational Engineering, Materials Engineering +13
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