Guidelines to select underfills for flip chip on board assemblies and compliant interposers for chip scale package assemblies

Solder Creep-Fatigue Analysis by an Energy-Partitioning Approach

Abhijit Dasgupta, Chen Oyan, D. B. Barker et al. · Journal of Electronic Packaging · 1992 · 223 citations

Engineering, Mechanical Engineering, Cold Working +16

Coffin-Manson fatigue model of underfilled flip-chips

Vadim Gektin, Avram Bar‐Cohen, Jennifer Ames · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1997 · 86 citations

Materials Science, Solder Bump Heights, Solder Shear Strain +15

On the Constitutive Response of 63/37 Sn/Pb Eutectic Solder

Andrew Skipor, S. V. Harren, J. Botsis · Journal of Engineering Materials and Technology · 1996 · 82 citations

Engineering, Mechanical Engineering, Isotropic Response +16

Process Induced Stresses of a Flip-Chip Packaging by Sequential Processing Modeling Technique

J. Wang, Zhengfang Qian, S. Liu · Journal of Electronic Packaging · 1998 · 37 citations

Engineering, Mechanical Engineering, Mechanics Modeling +18

Low-cost flip-chip on board

A.F.J. Baggerman, J.F.J.M. Caers, J.J. Wondergem et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1996 · 30 citations

3D Ic Architecture, Electrical Engineering, Chip-scale Package +15