Concepedia
Statistics
Publications
3
Citations
86
H-Index
Active since
1995
Affiliations
Philips (Finland)(Current)
Philips (Netherlands)
A.F.J. Baggerman is an author at Philips (Finland) specializing in microelectronics, engineering, and electronic packaging.
Top concepts
EngineeringMicroelectronicsElectronic PackagingMicrostructureApplied PhysicsMaterial ScienceMicrofabricationIntegrated CircuitsMaterials EngineeringElectrical Engineering
Publications per year
1995–1998
Reliable Au-Sn flip-chip bonding on flexible prints
A.F.J. Baggerman, M.J. Batenburg · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1995 · 35 citations
Engineering, Mechanical Engineering, Integrated Circuits +18
Low-cost flip-chip on board
A.F.J. Baggerman, J.F.J.M. Caers, J.J. Wondergem et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1996 · 30 citations
3D Ic Architecture, Electrical Engineering, Chip-scale Package +15
Solder-jetted eutectic PbSn bumps for flip-chip
A.F.J. Baggerman, D. Schwarzbach · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1998 · 21 citations
Engineering, Mechanical Engineering, Advanced Packaging (Semiconductors) +17
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