Concepedia

Vadim Gektin

VG

Statistics

Publications

9

Citations

450

H-Index

9

Active since

1997

Affiliations

University of Minnesota(Current)

Huawei Technologies (United States)

Binghamton University

Applied Materials (United States)

Oracle (United States)

Vadim Gektin is an author at University of Minnesota specializing in engineering, electronic packaging, and thermal engineering.

Top concepts

EngineeringElectronic PackagingHeat TransferMicroelectronicsThermal EngineeringElectrical EngineeringRefrigerationThermodynamicsThermal ModelingEnergy Efficiency

Publications per year

1997–2020

9

Publications

9

Electronics Thermal Management in Information and Communications Technologies: Challenges and Future Directions

Suresh V. Garimella, Tim Persoons, Justin A. Weibel et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2016 · 227 citations · Full text

Engineering, Energy Efficiency, Thermal Management Challenges +20

Coffin-Manson fatigue model of underfilled flip-chips

Vadim Gektin, Avram Bar‐Cohen, Jennifer Ames · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1997 · 86 citations

Materials Science, Solder Bump Heights, Solder Shear Strain +15

Coffin-Manson based fatigue analysis of underfilled DCAs

Vadim Gektin, Avram Bar‐Cohen, S. Witzman · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1998 · 56 citations

Engineering, Fatigue Analysis, Mechanical Engineering +22

Mechanistic figures of merit for die-attach materials

Vadim Gektin, Avram Bar‐Cohen · 2002 · 22 citations

Engineering, Mechanistic Figures, Mechanical Engineering +17

Establishing Thermal Air-cooled Limit for High Performance Electronics Devices

Gamal Refai-Ahmed, Hoa Do, Yaser Hadad et al. · 2020 · 14 citations

Engineering, Liquid Metal Cooling, Energy Efficiency +20

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