J. H. Okura

Statistics

Publications

Citations

150

H-Index

Active since

1998

Affiliations

University of Maryland, College Park(Current)

Philips (Netherlands)

Nokia (Finland)

J. H. Okura is an author at University of Maryland, College Park specializing in materials engineering, underfill materials, and mechanical behavior of materials.

Publications per year

1998–2004

Publications

Guidelines to select underfills for flip chip on board assemblies and compliant interposers for chip scale package assemblies

J. H. Okura, Santosh Shetty, Balamurali Ramakrishnan et al. · Microelectronics Reliability · 2000 · 34 citations

Engineering, Materials Engineering, Packaging Design +15

Impact of underfill filler particles on reliability of flip-chip interconnects

Krishna Darbha, J. H. Okura, Abhijit Dasgupta · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1998 · 29 citations

Engineering, Materials Engineering, Materials Science +16

Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 2—With Underfill

Krishna Darbha, J. H. Okura, Santosh Shetty et al. · Journal of Electronic Packaging · 1999 · 23 citations

Engineering, Materials Engineering, Materials Science +17

Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 1—Without Underfill

Krishna Darbha, J. H. Okura, Abhijit Dasgupta · Journal of Electronic Packaging · 1999 · 19 citations

Engineering, Materials Engineering, Materials Science +17

Flip Chip on Board: Assessment of Reliability in Cellular Phone Application

M. Sillanpää, J. H. Okura · IEEE Transactions on Components and Packaging Technologies · 2004 · 19 citations

Engineering, Computer Engineering, Electrical Engineering +17

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