Concepedia

Santosh Shetty

SS

5

Publications

163

Citations

5

H-Index

1999

Active since

Affiliations

University of Maryland, College Park(Current)

Nokia (Finland)

Philips (Netherlands)

Santosh Shetty is an author at University of Maryland, College Park specializing in electronic packaging, engineering, and mechanical engineering.

Top concepts

EngineeringElectronic PackagingStructural MechanicsMechanical EngineeringMechanics Of MaterialsComputer EngineeringSolid MechanicsMaterial ScienceMicroelectronicsAdvanced Packaging

Publications per year

1999–2003

5

Publications

5

Three- and Four-Point Bend Testing for Electronic Packages

Santosh Shetty, T. Reinikainen · Journal of Electronic Packaging · 2003 · 56 citations

Engineering, Mechanical Engineering, Structural Engineering +19

Fatigue of Chip Scale Package Interconnects Due to Cyclic Bending

Santosh Shetty, Ville Lehtinen, Abhijit Dasgupta et al. · Journal of Electronic Packaging · 2000 · 39 citations

Engineering, Chip Scale Package, Mechanical Engineering +18

Guidelines to select underfills for flip chip on board assemblies and compliant interposers for chip scale package assemblies

J. H. Okura, Santosh Shetty, Balamurali Ramakrishnan et al. · Microelectronics Reliability · 2000 · 34 citations

Advanced Packaging, Flip Chip, 3D Ic Architecture +11

Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 2—With Underfill

Krishna Darbha, J. H. Okura, Santosh Shetty et al. · Journal of Electronic Packaging · 1999 · 23 citations

Engineering, Mechanical Engineering, Interconnect (Integrated Circuits) +19

Guidelines to select underfills for flip chip on board assemblies

J. H. Okura, Krishna Darbha, Santosh Shetty et al. · 2003 · 11 citations

Materials Science, Flip Chip, Physical Design (Electronics) +15

Rows per page

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