Concepedia

Author

Krishna Darbha

University of Maryland, College Park

Also Known As

K. Darbha, Krishna Darbha

15

Publications

130

Citations

6

H-Index

26

Concepts

All Affiliations

University of Maryland, College ParkPhilips (Netherlands)
KD

About

Krishna Darbha is an author at University of Maryland, College Park specializing in mechanics of materials, electronic packaging, and mechanical engineering.

Top Concepts

#ConceptH-IndexPublicationsCitations

1

Engineering

6

6

107

2

Electrical Engineering

3

3

62

3

Applied Physics

2

2

40

4

Computer Engineering

2

2

34

5

Materials Science

2

2

22

Krishna Darbha

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6

Publications

107

Citations

6

H-Index

YearCitations

Impact of underfill filler particles on reliability of flip-chip interconnects

Krishna Darbha, J. H. Okura, Abhijit Dasgupta

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

1998

29

Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 2—With Underfill

Krishna Darbha, J. H. Okura, Santosh Shetty,

Journal of Electronic Packaging

1999

23

Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 1—Without Underfill

Krishna Darbha, J. H. Okura, Abhijit Dasgupta

Journal of Electronic Packaging

1999

19

Stress Analysis of Surface-Mount Interconnections Due to Vibrational Loading

Krishna Darbha, S. Ling, Abhijit Dasgupta

Journal of Electronic Packaging

1997

14

Impact of usage conditions on solder joint fatigue life

Zhen Zhang, S B Park, Krishna Darbha,

2010

11

Guidelines to select underfills for flip chip on board assemblies

J. H. Okura, Krishna Darbha, Santosh Shetty,

2003

11

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