Krishna Darbha

Publications

107

Citations

H-Index

1997

Active since

Affiliations

University of Maryland, College Park(Current)

Philips (Netherlands)

Krishna Darbha is an author at University of Maryland, College Park specializing in mechanics of materials, electronic packaging, and mechanical engineering.

Top concepts

EngineeringElectronic PackagingMechanical EngineeringMechanics Of MaterialsSolid MechanicsStructural MechanicsMicroelectronicsMechanical BehaviorElectrical EngineeringHeat Transfer

Publications per year

1997–2010

Publications

Impact of underfill filler particles on reliability of flip-chip interconnects

Krishna Darbha, J. H. Okura, Abhijit Dasgupta · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1998 · 29 citations

Engineering, Parametric Analytical Studies, Mechanical Engineering +17

Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 2—With Underfill

Krishna Darbha, J. H. Okura, Santosh Shetty et al. · Journal of Electronic Packaging · 1999 · 23 citations

Engineering, Mechanical Engineering, Interconnect (Integrated Circuits) +19

Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 1—Without Underfill

Krishna Darbha, J. H. Okura, Abhijit Dasgupta · Journal of Electronic Packaging · 1999 · 19 citations

Engineering, Mechanical Engineering, Interconnect (Integrated Circuits) +17

Stress Analysis of Surface-Mount Interconnections Due to Vibrational Loading

Krishna Darbha, S. Ling, Abhijit Dasgupta · Journal of Electronic Packaging · 1997 · 14 citations

Engineering, Mechanical Engineering, Residual Stress +16

Impact of usage conditions on solder joint fatigue life

Zhen Zhang, S B Park, Krishna Darbha et al. · 2010 · 11 citations

Engineering, Mechanical Engineering, Usage Conditions +21

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