S. Ling

Publications

Citations

H-Index

1996

Active since

Affiliations

Johns Hopkins University Applied Physics Laboratory(Current)

S. Ling is an author at Johns Hopkins University Applied Physics Laboratory specializing in electrical engineering, electronic packaging, and engineering.

Top concepts

EngineeringElectronic PackagingElectrical EngineeringMechanical BehaviorStructural MechanicsMechanical EngineeringMechanics Of MaterialsStructural OptimizationEducationTechnology

Publications per year

1996–2023

Publications

A Nonlinear Multi-Domain Stress Analysis Method for Surface-Mount Solder Joints

S. Ling, Abhijit Dasgupta · Journal of Electronic Packaging · 1996 · 18 citations

Friction Welding, Engineering, Mechanical Engineering +20

The Lucy Long Range Reconnaissance Imager (L’LORRI)

H. A. Weaver, John P. Wilson, Steven J. Conard et al. · Space Science Reviews · 2023 · 17 citations · Full text

Stress Analysis of Surface-Mount Interconnections Due to Vibrational Loading

Krishna Darbha, S. Ling, Abhijit Dasgupta · Journal of Electronic Packaging · 1997 · 14 citations

Engineering, Mechanical Engineering, Residual Stress +16

Electronic packaging for extended mars surface missions

Andrew A. Shapiro, S. Ling, Subramaniam Ganesan et al. · 2004 · 11 citations

Engineering, Energy Efficiency, Extended Mars Missions +19

Comparison of flip chip technologies on rigid polyimide with respect to reliability and manufacturing costs

R. Miessner, R. Aschenbrenner, H. Reichi et al. · 2000 · 10 citations

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