R. Miessner

Publications

119

Citations

H-Index

1997

Active since

Affiliations

Fraunhofer Institute for Reliability and Microintegration(Current)

Technische Universität Berlin

R. Miessner is an author at Fraunhofer Institute for Reliability and Microintegration specializing in engineering, electrical engineering, and materials science.

Top concepts

EngineeringMaterial ScienceElectronic PackagingElectrical EngineeringMicroelectronicsMicrofabricationFlexible ElectronicsGrapheneHeat TransferThermodynamics

Publications per year

1997–2008

Publications

Recent progress of thermal interface material research - an overview

Johan Liu, Bruno Michel, M. Rencz et al. · 2008 · 42 citations

Engineering, Thermal Conductivity, Aluminum Oxide +16

Adhesive flip chip bonding on flexible substrates

R. Aschenbrenner, R. Miessner, H. Reichl · 1997 · 38 citations

Materials Science, Electrical Engineering, Engineering +15

Reliability study of flip chip on FR4 interconnections with ACA

R. Miessner, R. Aschenbrenner, H. Reichl · 1999 · 29 citations

Engineering, Mechanical Engineering, Flip Chip Interconnections +16

Comparison of flip chip technologies on rigid polyimide with respect to reliability and manufacturing costs

R. Miessner, R. Aschenbrenner, H. Reichi et al. · 2000 · 10 citations

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