Concepedia

T. Reinikainen

TR

25

Publications

732

Citations

18

H-Index

1992

Active since

Affiliations

Nokia (Finland)(Current)

Nokia (United States)

The University of Texas at Arlington

University of Maryland, College Park

Philips (Netherlands)

T. Reinikainen is an author at Nokia (Finland) specializing in engineering, mechanical engineering, and electronic packaging.

Top concepts

EngineeringMechanical EngineeringElectronic PackagingMechanics Of MaterialsSolid MechanicsStructural MechanicsMaterial ScienceElectrical EngineeringComputer EngineeringMechanics

Publications per year

1992–2009

25

Publications

25

Deformation characteristics and microstructural evolution of SnAgCu solder joints

T. Reinikainen, Pekka Marjamäki, J.K. Kivilahti · 2005 · 74 citations

Materials Science, Friction Welding, Engineering +14

Deformation behavior of dilute SnBi(0.5 to 6 at. pct) solid solutions

T. Reinikainen, J.K. Kivilahti · Metallurgical and Materials Transactions A · 1999 · 69 citations

Materials Science, Materials Engineering, Material Analysis +9

Three- and Four-Point Bend Testing for Electronic Packages

Santosh Shetty, T. Reinikainen · Journal of Electronic Packaging · 2003 · 56 citations

Engineering, Mechanical Engineering, Structural Engineering +19

Absolute and relative fatigue life prediction methodology for virtual qualification and design enhancement of lead-free BGA

Hun Shen Ng, Tong Yan Tee, Kim Yong Goh et al. · 2005 · 40 citations

Engineering, Industrial Engineering, Life Prediction +22

Fatigue of Chip Scale Package Interconnects Due to Cyclic Bending

Santosh Shetty, Ville Lehtinen, Abhijit Dasgupta et al. · Journal of Electronic Packaging · 2000 · 39 citations

Engineering, Chip Scale Package, Mechanical Engineering +18

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