Concepedia

Ville Lehtinen

VL

2

Publications

50

Citations

2

H-Index

1999

Active since

Affiliations

Nokia (Finland)(Current)

Ville Lehtinen is an author at Nokia (Finland) specializing in electronic packaging, mechanical engineering, and electrical engineering.

Top concepts

EngineeringElectronic PackagingElectrical EngineeringMechanical EngineeringMechanicsHeat TransferSolid MechanicsMaterial ScienceMicroelectronicsMicrofabrication

Publications per year

1999–2000

2

Publications

2

Fatigue of Chip Scale Package Interconnects Due to Cyclic Bending

Santosh Shetty, Ville Lehtinen, Abhijit Dasgupta et al. · Journal of Electronic Packaging · 2000 · 39 citations

Engineering, Chip Scale Package, Mechanical Engineering +18

Qualification of flip chip fluxes by wetting balance and surface insulation resistance tests

Aulis Tuominen, E. Ristolainen, Ville Lehtinen · Soldering and Surface Mount Technology · 1999 · 11 citations

Engineering, Mechanical Engineering, Flip Chip +16

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