Concepedia
Statistics
Publications
3
Citations
44
H-Index
Active since
2004
Affiliations
Nokia (Finland)(Current)
University of Maryland, College Park
M. Sillanpää is an author at Nokia (Finland) specializing in device reliability, engineering, and mems reliability.
Publications per year
2004–2012
Flip Chip on Board: Assessment of Reliability in Cellular Phone Application
M. Sillanpää, J. H. Okura · IEEE Transactions on Components and Packaging Technologies · 2004 · 19 citations
Engineering, Computer Engineering, Electrical Engineering +17
Testing and multi-scale modeling of drop and impact loading of complex MEMS microphone assemblies
Toni T. Mattila, Abhijit Dasgupta, M. Sillanpää et al. · 2012 · 14 citations
Engineering, Mechanical Engineering, Systems Engineering +17
Drop qualification of MEMS components in handheld electronics at extremely high accelerations
Toni T. Mattila, Abhijit Dasgupta, M. Sillanpää et al. · 2012 · 11 citations
Engineering, Electrical Engineering, Mechanical Engineering +17
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