Concepedia

Andrew Skipor

AS

Statistics

Publications

8

Citations

277

H-Index

8

Active since

1995

Affiliations

Motorola (United States)(Current)

University of Illinois Chicago

University of Illinois Urbana-Champaign

Andrew Skipor is an author at Motorola (United States) specializing in engineering, electronic packaging, and mechanical engineering.

Top concepts

EngineeringElectronic PackagingMechanical EngineeringMechanics Of MaterialsSolid MechanicsMaterial ScienceMicroelectronicsStructural MechanicsMechanicsMicrostructure

Publications per year

1995–2005

8

Publications

8

On the Constitutive Response of 63/37 Sn/Pb Eutectic Solder

Andrew Skipor, S. V. Harren, J. Botsis · Journal of Engineering Materials and Technology · 1996 · 82 citations

Engineering, Mechanical Engineering, Isotropic Response +16

Mechanical cycling fatigue of PBGA package interconnects

Larry Leicht, Andrew Skipor · Microelectronics Reliability · 2000 · 47 citations

Engineering, Hardware Reliability, Low-cycle Fatigue +7

Encapsulation Of Flip Chip Structures

S. Machuga, S. Lindsey, K.D. Moore et al. · 2005 · 42 citations

Engineering, Advanced Packaging (Semiconductors), Microfabrication +7

Mechanical characterization of plastic ball grid array package flexure using moire interferometry

Andrew Skipor, Nancy R. Sottos, Eugene A. Stout · IEEE Transactions on Advanced Packaging · 2000 · 32 citations

Engineering, Micromechanics, Mechanical Engineering +18

Die cracking in flip-chip-on-board assembly

Kai Hu, Chao-Pin Yeh, B. Doot et al. · 2002 · 22 citations

Engineering, Mechanical Engineering, Defect Tolerance +18

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