Concepedia

Larry Leicht

LL

Statistics

Publications

2

Citations

69

H-Index

2

Active since

2000

Affiliations

Motorola (United States)(Current)

Larry Leicht is an author at Motorola (United States) specializing in mechanics of materials, electronic packaging, and mechanical engineering.

Top concepts

EngineeringElectronic PackagingMechanical EngineeringMechanics Of MaterialsFatigue3D PrintingSolid MechanicsMaterial ScienceMicroelectronicsStructural Mechanics

Publications per year

2000–2002

2

Publications

2

Mechanical cycling fatigue of PBGA package interconnects

Larry Leicht, Andrew Skipor · Microelectronics Reliability · 2000 · 47 citations

Engineering, Hardware Reliability, Low-cycle Fatigue +7

Mechanical bending fatigue reliability and its application to area array packaging

Andrew Skipor, Larry Leicht · 2002 · 22 citations

Engineering, Mechanical Engineering, Reliability Engineering +18

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