Concepedia
Thin Solid Films · 2004 · 34 citations · 8 references
Materials EngineeringMaterials ScienceCopper DiffusionMos DevicesEngineeringTan Barrier MaterialsSemiconductor TechnologyDiffusion ResistanceSurface ScienceApplied PhysicsSemiconductor MaterialCharge Carrier Transport
8
Barrier Properties of Very Thin Ta and TaN Layers Against Copper Diffusion
M. T. Wang, Yu-Chuan Lin, M. C. Chen · Journal of The Electrochemical Society · 1998 · 148 citations
Engineering, Integrated Circuits, Thin Film Process Technology +18
Interdiffusions in Cu/reactive-ion-sputtered TiN, Cu/chemical-vapor-deposited TiN, Cu/TaN, and TaN/Cu/TaN thin-film structures: Low temperature diffusion analyses
J. O. Olowolafe, C. J. Mogab, R. B. Gregory et al. · Journal of Applied Physics · 1992 · 114 citations
Electromigration in a single crystalline submicron width aluminum interconnection
Shoso Shingubara, Yasushi Nakasaki, Hisashi Kaneko · Applied Physics Letters · 1991 · 89 citations
Materials Engineering, Materials Science, Electrical Engineering +14
Amorphouslike chemical vapor deposited tungsten diffusion barrier for copper metallization and effects of nitrogen addition
Kow-Ming Chang, Ta‐Hsun Yeh, I‐Chung Deng et al. · Journal of Applied Physics · 1997 · 54 citations
Engineering, Chemical Deposition, Semiconductors +21
The copper–silicon interface: Composition and interdiffusion
Stewart Corn, John L. Falconer, A. W. Czanderna · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 1988 · 53 citations
Materials Science, Surface Characterization, Engineering +13