I‐Chung Deng

Amorphouslike chemical vapor deposited tungsten diffusion barrier for copper metallization and effects of nitrogen addition

Kow-Ming Chang, Ta‐Hsun Yeh, I‐Chung Deng et al. · Journal of Applied Physics · 1997 · 55 citations

Engineering, Materials Engineering, Materials Science +17

A circular CPW‐FED slot antenna for broadband circularly polarized radiation

I‐Chung Deng, Jinbo Chen, Qing‐Xiang Ke et al. · Microwave and Optical Technology Letters · 2007 · 38 citations · Full text

Engineering, Electrical Engineering, Antennas +16

Characteristics of IGZO TFT Prepared by Atmospheric Pressure Plasma Jet Using PE-ALD $\hbox{Al}_{2}\hbox{O}_{3}$ Gate Dielectric

Chien‐Hung Wu, Kow‐Ming Chang, Sung-Hung Huang et al. · IEEE Electron Device Letters · 2012 · 35 citations

Natural Sciences, Materials Engineering, Materials Science +16

Nitridation of fine grain chemical vapor deposited tungsten film as diffusion barrier for aluminum metallization

Kow-Ming Chang, Ta‐Hsun Yeh, I‐Chung Deng · Journal of Applied Physics · 1997 · 32 citations

Natural Sciences, Materials Engineering, Materials Science +15

Highly selective etching for polysilicon and etch-induced damage to gate oxide with halogen-bearing electron-cyclotron-resonance plasma

Kow-Ming Chang, Ta‐Hsun Yeh, I‐Chung Deng et al. · Journal of Applied Physics · 1996 · 28 citations

Engineering, Electrical Engineering, Materials Science +16