Study of adhesive flip chip bonding process and failure mechanisms of ACA joints

Design and understanding of anisotropic conductive films (ACF's) for LCD packaging

Myung-Jin Yim, Kyung-Wook Paik · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1998 · 180 citations

Natural Sciences, Materials Engineering, Materials Science +17

Anisotropically conductive adhesive flip-chip bonding on rigid and flexible printed circuit substrates

Zonghe Lai, Johan Liu · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1996 · 156 citations

Engineering, Materials Engineering, Materials Science +17

A reliable and environmentally friendly packaging technology-flip-chip joining using anisotropically conductive adhesive

J. Liu, A. Tolvgard, J. Malmodin et al. · IEEE Transactions on Components and Packaging Technologies · 1999 · 106 citations

Engineering, Electrical Engineering, Materials Science +17

A new approach to using anisotropically conductive adhesives for flip chip assembly

Alan M. Lyons, Emily Hall, Yiu-Huen Wong et al. · 2002 · 30 citations

Engineering, Materials Engineering, Materials Science +16

Reliability study of flip chip on FR4 interconnections with ACA

R. Miessner, R. Aschenbrenner, H. Reichl · 1999 · 29 citations

Engineering, Materials Engineering, Materials Science +17