Integration of copper multilevel interconnects with oxide and polymer interlevel dielectrics

Advanced multilayer metallization schemes with copper as interconnection metal

S. P. Murarka, R.J. Gutmann, Alain E. Kaloyeros et al. · Thin Solid Films · 1993 · 246 citations

Natural Sciences, Materials Engineering, Materials Science +12

Pattern Geometry Effects in the Chemical‐Mechanical Polishing of Inlaid Copper Structures

Joseph M. Steigerwald, R. Zirpoli, S. P. Murarka et al. · Journal of The Electrochemical Society · 1994 · 128 citations

Engineering, Materials Engineering, Materials Science +10

Formation of Copper Thin Films by a Low Kinetic Energy Particle Process

Tadahiro Ohmi, Tatsuyuki Saito, M. Otsuki et al. · Journal of The Electrochemical Society · 1991 · 79 citations

Natural Sciences, Materials Engineering, Materials Science +17

Contact and via structures with copper interconnects fabricated using dual Damascene technology

S. Lakshminarayanan, Joseph M. Steigerwald, D.T. Price et al. · IEEE Electron Device Letters · 1994 · 61 citations

Engineering, Electrical Engineering, Materials Science +17

Chemical Vapor Deposition of Copper for Multilevel Metallization

Alain E. Kaloyeros, Michael A. Fury · MRS Bulletin · 1993 · 58 citations

Natural Sciences, Materials Engineering, Materials Science +14