Concepedia

Interlayer Dielectric Integration

Interlayer Dielectric Integration is a materials integration methodology in semiconductor manufacturing that comprises the strategic deposition and patterning of dielectric layers between metal interconnects to electrically isolate them while enabling multilevel wiring structures in integrated circuits.

62

Publications

2.1K

Citations

461

Authors

86

Institutions

Publications per year

2017–2026

10

Parents

Publications

62

Plasmonic Nanohole Arrays on a Robust Hybrid Substrate for Highly Sensitive Label-Free Biosensing

Arif E. Çetin, Dordaneh Etezadi, Betty C. Galarreta et al. · ACS Photonics · 2015 · 196 citations · Full text

, , +17

Silicon interposer with TSVs (Through Silicon Vias) and fine multilayer wiring

Masahiro Sunohara, Takashi Kurihara, Mitsutoshi Higashi · 2008 · 154 citations

, , +17

Low dielectric constant materials and methods for interlayer dielectric films in ultralarge-scale integrated circuit multilevel interconnections

Tetsuya Homma · Materials Science and Engineering R Reports · 1998 · 110 citations

, , +16

Investigating the output performance of triboelectric nanogenerators with single/double-sided interlayer

Chuanfu Xin, Zhongjie Li, Qin Zhang et al. · Nano Energy · 2022 · 85 citations

, , +13

Metal–Organic Frameworks: New Interlayer Dielectric Materials

Muhammad Usman, Shruti Mendiratta, Kuang‐Lieh Lu · ChemElectroChem · 2015 · 76 citations

, , +15

1–5 of 62

Authors

461

  1. TH
    Tetsuya Homma

    Shibaura Institute of Technology, Japan

    4 publications · 179 citations

    4

    h-index

  2. PB
    P. Batude

    Commissariat à l'Énergie Atomique et aux Énergies Alternatives, France

    3 publications · 76 citations

    3

    h-index

  3. ŞA
    Ş. Altındal

    Gazi University, Türkiye

    3 publications · 122 citations

    3

    h-index

  4. YM
    Yukinobu Murao

    NEC (Japan), Japan

    3 publications · 60 citations

    3

    h-index

  5. BP
    B. Prévitali

    Commissariat à l'Énergie Atomique et aux Énergies Alternatives, France

    3 publications · 76 citations

    3

    h-index

1–5 of 461

Institutions

86

  1. NEC (Japan)

    Tokyo, Japan

    6 h-index

    32 publications

    500 citations

  2. Intel (United States)

    Santa Clara, United States

    5 h-index

    69 publications

    1.7K citations

  3. Georgia Institute of Technology

    Atlanta, United States

    4 h-index

    11 publications

    276 citations

  4. Motorola (United States)

    Schaumburg, United States

    3 h-index

    45 publications

    938 citations

  5. University of Mohaghegh Ardabili

    Ardabil, Iran

    3 h-index

    3 publications

    122 citations

  6. Gazi University

    Ankara, Turkey

    3 h-index

    8 publications

    301 citations

  7. Sabalan University of Advanced Technologies

    Namīn, Iran

    3 h-index

    3 publications

    122 citations

  8. IMEC

    Leuven, Belgium

    3 h-index

    13 publications

    171 citations

1–8 of 86

Venues

  1. IEEE Transactions on Electron Devices

    5 publications · 79 citations

    5

    h-index

  2. Thin Solid Films

    5 publications · 111 citations

    5

    h-index

  3. Journal of The Electrochemical Society

    JES · 3 publications · 60 citations

    3

    h-index

  4. IEEE Electron Device Letters

    2 publications · 51 citations

    2

    h-index

  5. Japanese Journal of Applied Physics

    JJAP · 2 publications · 69 citations

    2

    h-index

1–5