Mitsutoshi Higashi

Silicon interposer with TSVs (Through Silicon Vias) and fine multilayer wiring

Masahiro Sunohara, Takashi Kurihara, Mitsutoshi Higashi · 2008 · 153 citations

Engineering, Silicon Vias, Silicon On Insulator +18

A Silicon interposer BGA package with Cu-filled TSV and multi-layer Cu-plating interconnect

K. Kumagai, Yuko Yoneda, Hitoshi Izumino et al. · 2008 · 85 citations

Studies on electrical performance and thermal stress of a silicon interposer with TSVs

Masahiro Sunohara, Hideaki Sakaguchi, Akihito Takano et al. · 2010 · 51 citations

Engineering, Electrical Performance, Wafer Scale Processing +17

Warpage control of silicon interposer for 2.5D package application

Kei Murayama, Mitsuhiro Aizawa, K. Hara et al. · 2013 · 42 citations

Development of silicon module with TSVs and global wiring (L/S=0.8/0.8µm)

Masahiro Sunohara, Akinori Shiraishi, Yuichi Taguchi et al. · 2009 · 27 citations

High Density, Electrical Engineering, Engineering +14