17
Publications
412
Citations
12
H-Index
2004
Active since
Kei Murayama is an author at Shinko Electric Industries (Japan) specializing in engineering, microelectronics, and electronic packaging.
Top concepts
EngineeringMicroelectronicsElectronic PackagingMaterial ScienceElectrical EngineeringApplied PhysicsFluid DynamicsMicrofabricationElectrochemistryAdvanced Packaging
Publications per year
2004–2023
17
17
Warpage control of silicon interposer for 2.5D package application
Kei Murayama, Mitsuhiro Aizawa, K. Hara et al. · 2013 · 42 citations
Rows per page
1–5 of 17