Mitsuhiro Aizawa

Warpage control of silicon interposer for 2.5D package application

Kei Murayama, Mitsuhiro Aizawa, K. Hara et al. · 2013 · 42 citations

Study of electro-migration resistivity of micro bump using SnBi solder

Kei Murayama, Mitsuhiro Aizawa, Mitsutoshi Higashi · 2014 · 11 citations

Engineering, Flip Chip Package, Interconnect (Integrated Circuits) +16

Direct Cu-Cu bonding by low-temperature sintering using three-dimensional nanostructured plated Cu films

Susumu Arai, Soichiro Nakajima, Masahiro Shimizu et al. · Materials Today Communications · 2023 · 11 citations · Full text

Materials Science, Cu Films, Low-temperature Sintering +14

Low stress bonding for large size die application

Kei Murayama, Mitsuhiro Aizawa, Takashi Kurihara · 2015 · 10 citations

Engineering, Mechanical Engineering, Large Die +18

Study of Crystal Orientation and Microstructure in Sn-Bi and Sn-Ag-Cu Solder with Thermal Compression Bonding and Mass Reflow

Kei Murayama, Mitsuhiro Aizawa, Takashi Kurihara · 2016 · 10 citations