IEEE Electron Device Letters · 2012 · 10 citations · 5 references
EngineeringElectrical EngineeringMaterials ScienceMicroelectronicsMicrowave EngineeringSemiconductor DevicesBipolar Junction TransistorsDevice CharacterizationHigh-frequency Semiconductor DevicesIntegrated Circuit DesignMicrowave Semiconductor DevicesSemiconductor HeterostructuresCurrent GainHeterojunction Bipolar TransistorsHeterostructure TransistorsMicrowave TransistorsMillimeter-wave Transistors
Self-aligned 0.55×3.5 μm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> emitter InP/GaAsSb/InP double heterojunction bipolar transistors demonstrating an f <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">t</sub> of 310 GHz and an f <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">max</sub> of 480 GHz are reported. Common-emitter current gain of 24, together with a breakdown voltage of 4.6 V, is measured. The devices were fabricated with a triple-mesa process and easily fabricated with a new base isolation μ-airbridge design which, moreover, significantly reduced the base-collector capacitance C <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">BC</sub> .
5
Application of micro-airbridge isolation in high speed HBT fabrication
S. Tadayon, G. Metze, A. Cornfeld et al. · Electronics Letters · 1993 · 14 citations
Engineering, Electrical Engineering, Materials Engineering +17