Effects of Copper Plasticity on the Induction of Stress in Silicon from Copper Through-Silicon Vias (TSVs) for 3D Integrated Circuits

Micro-Raman spectroscopy to study local mechanical stress in silicon integrated circuits

Ingrid De Wolf · Semiconductor Science and Technology · 1996 · 970 citations

Engineering, Electrical Engineering, Materials Science +17

Stress measurements in silicon devices through Raman spectroscopy: Bridging the gap between theory and experiment

Ingrid De Wolf, H.E. Maes, Stephen Jones · Journal of Applied Physics · 1996 · 350 citations

Engineering, Materials Engineering, Materials Science +17

A study of thermo-mechanical stress and its impact on through-silicon vias

N. Ranganathan, K. Prasad, N. Balasubramanian et al. · Journal of Micromechanics and Microengineering · 2008 · 169 citations

Engineering, Electrical Engineering, Materials Science +17

Through silicon via technology — processes and reliability for wafer-level 3D system integration

Peter Ramm, M. J. Wolf, Armin Klumpp et al. · 2008 · 118 citations

Engineering, Materials Engineering, Materials Science +17

The rise of the 3rd dimension for system intergration

Eric Beyne · 2006 · 105 citations

Engineering, Computer Engineering, Electrical Engineering +17