Colin McDonough

The AIM Photonics MPW: A Highly Accessible Cutting Edge Technology for Rapid Prototyping of Photonic Integrated Circuits

Nicholas M. Fahrenkopf, Colin McDonough, Gerald Leake et al. · IEEE Journal of Selected Topics in Quantum Electronics · 2019 · 188 citations · Full text

Engineering, Device Integration, Integrated Photonics +20

Demonstration of an optical chip-to-chip link in a 3D integrated electronic-photonic platform

Krishna T. Settaluri, Sen Lin, Sajjad Moazeni et al. · 2015 · 43 citations

Optical Materials, Engineering, Device Integration +19

Free‐Form Micro‐Optics Enabling Ultra‐Broadband Low‐Loss Off‐Chip Coupling

Shaoliang Yu, Luigi Ranno, Qingyang Du et al. · Laser & Photonics Review · 2023 · 23 citations · Full text

Optical Materials, Engineering, Integrated Photonics +16

TSV Stress Testing and Modeling for 3D IC Applications

Thenappan Chidambaram, Colin McDonough, Robert Geer et al. · 2009 · 14 citations

Engineering, Mechanical Engineering, Residual Stress +18

Effects of Copper Plasticity on the Induction of Stress in Silicon from Copper Through-Silicon Vias (TSVs) for 3D Integrated Circuits

Benjamin Backes, Colin McDonough, Larry Smith et al. · Journal of Electronic Testing · 2011 · 11 citations