Investigation of mechanical shock testing of lead-free SAC solder joints in fine pitch BGA package

Six cases of reliability study of Pb-free solder joints in electronic packaging technology

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Interfacial reactions between lead-free solders and common base materials

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Natural Sciences, Materials Engineering, Materials Science +12

Solder reaction-assisted crystallization of electroless Ni–P under bump metallization in low cost flip chip technology

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Natural Sciences, Materials Engineering, Materials Science +17

Solid state interfacial reaction of Sn–37Pb and Sn–3.5Ag solders with Ni–P under bump metallization

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Natural Sciences, Materials Engineering, Materials Science +17

The growth of intermetallic compounds at Sn-Ag-Cu solder/Cu and Sn-Ag-Cu solder/Ni interfaces and the associated evolution of the solder microstructure

A. Zribi, A. Clark, L. Zavalij et al. · Journal of Electronic Materials · 2001 · 122 citations

Natural Sciences, Materials Engineering, Materials Science +17