Concepedia

Yoong Tatt Chin

YT

Statistics

Publications

4

Citations

74

H-Index

4

Active since

2003

Affiliations

Intel (Malaysia)(Current)

Multimedia University

Yoong Tatt Chin is an author at Intel (Malaysia) specializing in materials engineering, materials science, and mechanical behavior of materials.

Publications per year

2003–2018

4

Publications

4

Investigation of mechanical shock testing of lead-free SAC solder joints in fine pitch BGA package

Yoong Tatt Chin, P.K. Lam, H. K. Yow et al. · Microelectronics Reliability · 2008 · 37 citations

Natural Sciences, Materials Engineering, Materials Science +10

Thermomechanical studies of surface mounted microelectronics by finite element analysis

Khai Shiang Tan, Sim Jui Oon, Li Yuan Teng et al. · Composites Part B Engineering · 2018 · 16 citations

Engineering, Electrical Engineering, Mechanical Engineering +14

Lead-free compatible underfill materials for flip chip applications

Choong Kooi Chee, Yoong Tatt Chin, Terry Sterrett et al. · 2003 · 11 citations

Natural Sciences, Materials Engineering, Materials Science +12

Effect of Solder Volume on Interfacial Reactions between Eutectic Sn-Pb and Sn-Ag-Cu Solders and Ni(P)-Au Surface Finish

Ali Ourdjini, Suck-Soo Koh, Kai Tan et al. · IEEE/CPMT International Electronics Manufacturing Technology Symposium · 2006 · 10 citations

Natural Sciences, Materials Engineering, Materials Science +17

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