IEEE Electron Device Letters · 2000 · 40 citations · 14 references
Materials EngineeringMaterials ScienceEngineeringCorrosionOxidation ResistanceOxide ElectronicsMechanical EngineeringChemistryHydrogenUltrathin In-situ SteamMicroelectronicsIssg OxideIn-situ SteamH/sub 2/Steam Distribution
This letter demonstrates the effect of H/sub 2/ percentage during oxidation on the quality of the in-situ steam generated (ISSG) oxide. Our results indicate the reliability of ISSG oxide is considerably improved as the H/sub 2/ percentage increases, from the viewpoint of stress-induced leakage current (SILC) and charge-to-breakdown (Q/sub BD/). Such enhanced reliability of the ISSG oxide may be explained by the reduction of defects in the SiO/sub 2/ network within the structural transition layer, such as Si dangling bonds, weak Si-Si and strained Si-O bonds, by highly reactive oxygen atoms which are hypothesized to be dissociated from the molecular oxygen due to the presence of hydrogen.
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