Warpage mechanism analyses of strip panel type PBGA chip packaging

References

Page 1

	Year	Citations
Characterization of chip scale packaging materials Masazumi Amagai Microelectronics Reliability Advanced PackagingMaterials ScienceChip-scale PackageEngineeringMicrofabrication	1999	75
The Effect of Epoxy Molding Compound on Thermal/Residual Deformations and Stresses in IC Packages During Manufacturing Process Μ. Y. Tsai, C.T. Wang, C. H. Hsu IEEE Transactions on Components and Packaging Technologies Thermal/residual DeformationsEngineeringMechanical EngineeringThermoplastic CompositeMolding (Process)	2006	58
Effect of temperature on elastic properties of woven-glass epoxy composites for printed circuit board applications Parsaoran Hutapea, Joachim L. Grenestedt Journal of Electronic Materials Materials ScienceEngineeringCircuit Board ApplicationsComposite TechnologyWoven-glass Epoxy Composites	2003	49
Numerical modeling of warpage induced in QFN array molding process Daoguo Yang, K.M.B. Jansen, L.J. Ernst, Microelectronics Reliability EngineeringMechanical EngineeringApplied PhysicsSolid MechanicsComputational Mechanics	2007	46
Correlation Between Measurement and Simulation of Thermal Warpage in PBGA With Consideration of Molding Compound Residual Strain Y.-C. Chen, S. W. Ricky Lee IEEE Transactions on Components and Packaging Technologies EngineeringMechanical EngineeringThermal WarpageStressstrain AnalysisCorrelation Between Measurement	2008	42
Warpage analysis of epoxy molded packages using viscoelastic based model Narasimalu Srikanth Journal of Materials Science Materials ScienceFibre-reinforced PlasticWarpage AnalysisEngineeringMechanical Behavior	2006	32
Viscoelastic Warpage Analysis of Surface Mount Package Kiyoshi Miyake, Tsukasa Yoshida, Hyung Gil Baik, Journal of Electronic Packaging EngineeringMultilayer Shell ElementMechanical EngineeringAdvanced Packaging (Semiconductors)Mechanics	2001	31
Isobaric cure shrinkage behaviors of epoxy molding compound in isothermal state Sheng‐Jye Hwang, Yi‐San Chang Journal of Polymer Science Part B Polymer Physics Materials ScienceEngineeringMechanical PropertiesPolymer StabilityIsothermal State	2005	26
Viscoelastic Effect of FR-4 Material on Packaging Stress Development Yeong K. Kim IEEE Transactions on Advanced Packaging Materials SciencePackaging Stress DevelopmentFibre-reinforced PlasticEngineeringMechanical Behavior	2007	21
Estimation of warpage and thermal stress of IVHs in flip–chip ball grid arrays package by FEM Seung-Hyun Cho Microelectronics Reliability Electrical EngineeringThermal StressEngineeringChip-scale PackageAdvanced Packaging (Semiconductors)	2007	21

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