Publication | Closed Access
Warpage analysis of epoxy molded packages using viscoelastic based model
32
Citations
6
References
2006
Year
Materials ScienceFibre-reinforced PlasticWarpage AnalysisEngineeringMechanical BehaviorMechanicsMechanical EngineeringSolid MechanicsElectronic PackagingThermoplastic CompositeMechanics Of MaterialsMolding (Process)
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