Characterization of chip scale packaging materials

Constitutive Equations for the Rate-Dependent Deformation of Metals at Elevated Temperatures

Lallit Anand · Journal of Engineering Materials and Technology · 1982 · 542 citations

Natural Sciences, Materials Engineering, Materials Science +17

Chip Scale Package (CSP) solder joint reliability and modeling

Masayuki Amagai · Microelectronics Reliability · 1999 · 80 citations

Engineering, Computer Engineering, Packaging Design +11

Chip scale package (CSP) solder joint reliability and modeling

Masayuki Amagai · 1998 · 32 citations

Engineering, Computer Engineering, Packaging Design +11