Fine pitch copper wire bonding in high volume production

Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging

C.J. Hang, Chunqing Wang, M. Mayer et al. · Microelectronics Reliability · 2007 · 239 citations

Materials Engineering, Materials Science, Growth Behavior +12

Effects of Cu/Al intermetallic compound (IMC) on copper wire and aluminum pad bondability

Hyoung-Joon Kim, Joo Yeon Lee, Kyung-Wook Paik et al. · IEEE Transactions on Components and Packaging Technologies · 2003 · 220 citations

Engineering, Mechanical Engineering, Copper Wire +16

An analysis of intermetallics formation of gold and copper ball bonding on thermal aging

S. Murali, Narasimalu Srikanth, Charles J. Vath · Materials Research Bulletin · 2003 · 122 citations

Materials Science, Materials Engineering, Engineering +11

The Development of Cu Bonding Wire With Oxidation-Resistant Metal Coating

Shingo Kaimori, Takamasa Nonaka, Akira Mizoguchi · IEEE Transactions on Advanced Packaging · 2006 · 112 citations

Materials Science, Materials Engineering, Electrical Engineering +15

Development of copper wire bonding application technology

K. Toyozawa, Kazuya Fujita, S. Minamide et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1990 · 105 citations

Materials Engineering, Materials Science, Electrical Engineering +13