Charles J. Vath

An analysis of intermetallics formation of gold and copper ball bonding on thermal aging

S. Murali, Narasimalu Srikanth, Charles J. Vath · Materials Research Bulletin · 2003 · 122 citations

Materials Science, Materials Engineering, Engineering +11

Development of through silicon via (TSV) interposer technology for large die (21×21mm) fine-pitch Cu/low-k FCBGA package

Xiaowu Zhang, T.C. Chai, John H. Lau et al. · 2009 · 109 citations

Engineering, Computer Architecture, Large Die +17

Grains, deformation substructures, and slip bands observed in thermosonic copper ball bonding

S. Murali, Narasimalu Srikanth, Charles J. Vath · Materials Characterization · 2003 · 87 citations

Materials Engineering, Materials Science, Deformation Substructures +9

Critical study of thermosonic copper ball bonding

Narasimalu Srikanth, S. Murali, Y.M. Wong et al. · Thin Solid Films · 2004 · 73 citations

Materials Engineering, Critical Study, Materials Science +6

Effect of wire size on the formation of intermetallics and Kirkendall voids on thermal aging of thermosonic wire bonds

S. Murali, Narasimalu Srikanth, Charles J. Vath · Materials Letters · 2004 · 66 citations

Materials Engineering, Materials Science, Wire Size +14