Andy Tseng

An evaluation of effects of molding compound properties on reliability of Cu wire components

Peng Su, Hidetoshi Seki, Ping Chen et al. · 2011 · 61 citations

Engineering, Cu Wire Bond, Compound Properties +18

Fine pitch copper wire bonding in high volume production

Bernd K. Appelt, Andy Tseng, Chun‐Hsiung Chen et al. · Microelectronics Reliability · 2010 · 55 citations

Materials Science, Materials Engineering, Electromigration Technique +8

Fine pitch copper wire bonding — Why now?

Bernd K. Appelt, Andy Tseng, Yi‐Shao Lai · 2009 · 26 citations

Engineering, Severe Plastic Deformation, Mechanical Engineering +16

Advanced QFN packaging for low cost and solution

Bill C.J., Bruce Hu, Mark W. Lin et al. · 2010 · 16 citations

Advanced Packaging, Electrical Engineering, Chip-scale Package +15

Is copper wire bonding ready for automotive applications?

Bernd K. Appelt, Andy Tseng, Louie Huang et al. · 2011 · 13 citations

Materials Science, Materials Engineering, Electrical Engineering +10