Concepedia

Hidetoshi Seki

HS

3

Publications

108

Citations

3

H-Index

2010

Active since

Affiliations

Sumitomo Bakelite (Japan)(Current)

Cisco Systems (China)

Advanced Semiconductor Engineering (Taiwan)

Hidetoshi Seki is an author at Sumitomo Bakelite (Japan) specializing in electronic packaging, materials engineering, and materials science.

Top concepts

CorrosionEngineeringMaterial ScienceMicroelectronicsElectronic PackagingMaterials EngineeringElectrical EngineeringMicrostructureApplied PhysicsFailure Analysis

Publications per year

2010–2012

3

Publications

3

An evaluation of effects of molding compound properties on reliability of Cu wire components

Peng Su, Hidetoshi Seki, Ping Chen et al. · 2011 · 61 citations

Engineering, Cu Wire Bond, Compound Properties +18

Study of EMC for Cu bonding wire application

Hidetoshi Seki, Ping Chen, Hiroshi Nakatake et al. · 2010 · 35 citations

Materials Science, Materials Engineering, Electrical Engineering +15

An evaluation of effects of molding compound and substrate material properties on reliability of Cu wire BGA components

Peng Su, Hidetoshi Seki, Yoshinori Nishitani et al. · 2012 · 12 citations

Engineering, Halogen Content, Mechanical Engineering +18

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