Louie Huang

An evaluation of effects of molding compound properties on reliability of Cu wire components

Peng Su, Hidetoshi Seki, Ping Chen et al. · 2011 · 61 citations

Engineering, Cu Wire Bond, Compound Properties +18

The corrosion behavior of Ag alloy wire bond on Al pad in molding compounds of various chlorine contents under biased-HAST

Ying-Ta Chiu, Tzu‐Hsing Chiang, Ping‐Feng Yang et al. · 2016 · 14 citations

Materials Engineering, Materials Science, Corrosion Technology +14

Three years of fine Cu wire bonding in high volume manufacturing

Bernd K. Appelt, Louie Huang, Yi‐Shao Lai et al. · 2011 · 13 citations

Materials Science, Materials Engineering, Electrical Engineering +15

Is copper wire bonding ready for automotive applications?

Bernd K. Appelt, Andy Tseng, Louie Huang et al. · 2011 · 13 citations

Materials Science, Materials Engineering, Electrical Engineering +10

An evaluation of effects of molding compound and substrate material properties on reliability of Cu wire BGA components

Peng Su, Hidetoshi Seki, Yoshinori Nishitani et al. · 2012 · 12 citations

Engineering, Halogen Content, Mechanical Engineering +18