The electrical property of plasma-treated Ta/TaNx diffusion barrier

Tantalum as a diffusion barrier between copper and silicon: Failure mechanism and effect of nitrogen additions

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Physics of Copper in Silicon

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Natural Sciences, Materials Science, Physics +17

Tantalum-based diffusion barriers in Si/Cu VLSI metallizations

E. Kolawa, Jen‐Sue Chen, J.S. Reid et al. · Journal of Applied Physics · 1991 · 222 citations · Full text

Engineering, Materials Engineering, Materials Science +17

Characteristics of ultrathin Ta and TaN films

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Behavior of thin Ta-based films in the Cu/barrier/Si system

M. Stavrev, D. Fischer, Frank Praessler et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 1999 · 78 citations

Natural Sciences, Materials Engineering, Materials Science +13