Ying-Lang Wang - Concepedia

Author

Ying-Lang Wang

National Cheng Kung University

Also Known As

Shih-Chieh Chang, Ying-Lang Wang

105

Publications

914

Citations

H-Index

Concepts

All Affiliations

National Cheng Kung University National Yang Ming Chiao Tung University Taiwan Semiconductor Manufacturing Company (Taiwan)National Chiayi University National University of Tainan

About

Ying-Lang Wang is an author at National Cheng Kung University specializing in engineering, materials science, and applied physics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	16	30	677
2	Applied Physics	14	18	449
3	Chemistry	10	10	195
4	Chemical Engineering	9	9	159
5	Natural Sciences	2	2	125

Ying-Lang Wang

Publications

706

Citations

H-Index

Page 1

	Year	Citations
Atomic-level quantized reaction of HfO<sub>x</sub> memristor Yong-En Syu, Ting‐Chang Chang, Jyun‐Hao Lou, Applied Physics Letters EngineeringPhase Change MemoryNanoelectronicsDynamic Switching BehaviorsQuantum Materials	2013	110
Effects of Varied Negative Stop Voltages on Current Self-Compliance in Indium Tin Oxide Resistance Random Access Memory Chih‐Yang Lin, Kuan‐Chang Chang, Ting‐Chang Chang, IEEE Electron Device Letters Non-volatile MemoryElectrical EngineeringEngineeringNanoelectronicsApplied Physics	2015	48
Interfacial reactions between Cu and SnAgCu solder doped with minor Ni Hsi-Kuei Cheng, Chin-Wen Huang, Hsuan Lee, Journal of Alloys and Compounds Materials EngineeringMaterials ScienceInterfacial ReactionsEngineeringCorrosion	2014	44
Asymmetric Carrier Conduction Mechanism by Tip Electric Field in $\hbox{WSiO}_{X}$ Resistance Switching Device Yong-En Syu, Ting‐Chang Chang, Tsung‐Ming Tsai, IEEE Electron Device Letters Non-volatile MemoryEngineeringEmerging Memory TechnologyCharge TransportPhase Change Memory	2012	37
Superpolishing for Planarizing Copper Damascene Interconnects Shih-Chieh Chang, Jia‐Min Shieh, Bau‐Tong Dai, Electrochemical and Solid-State Letters EngineeringElectrode-electrolyte InterfaceChemistryInterconnect (Integrated Circuits)Polyethylene Glycol	2003	32
Effect of plating current density and annealing on impurities in electroplated Cu film Chi-Wen Liu, Ying-Lang Wang, Ming-Shih Tsai, Journal of Vacuum Science & Technology A Vacuum Surfaces and Films	2005	29
Effect of copper barrier dielectric deposition process on characterization of copper interconnect Yi-Lung Cheng, Tai-Jung Chiu, Bor-Jou Wei, Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena Materials ScienceMaterials EngineeringElectrical EngineeringElectromigration TechniqueEngineering	2010	25
Effects of direct current and pulse-reverse copper plating waveforms on the incubation behavior of self-annealing Min‐Yuan Cheng, Kei-Wei Chen, Tzeng‐Feng Liu, Thin Solid Films Materials ScienceMaterials EngineeringElectrical EngineeringEngineeringMicrofabrication	2010	25
Effects of wetting ability of plating electrolyte on Cu seed layer for electroplated copper film Chi-Wen Liu, Jung-Chih Tsao, Ming-Shih Tsai, Journal of Vacuum Science & Technology A Vacuum Surfaces and Films Materials ScienceMaterials EngineeringChemical EngineeringElectrometallurgyCu Seed Layer	2004	22
Suppression Effect of Low-Concentration Bis-(3-sodiumsulfopropyl disulfide) on Copper Electroplating Chi-Cheng Hung, Wen-Hsi Lee, Shih-Chieh Chang, Journal of The Electrochemical Society Materials ScienceSuppression EffectChemical EngineeringEngineeringThiolate Complexes	2007	22

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