Concepedia
Statistics
Publications
4
Citations
139
H-Index
Active since
2014
Affiliations
National Chung Hsing University(Current)
Taiwan Semiconductor Manufacturing Company (Taiwan)
National Yang Ming Chiao Tung University
Hsi-Kuei Cheng is an author at National Chung Hsing University specializing in metals, electronic materials, and materials engineering.
Publications per year
2014–2017
Interfacial reactions between Cu and SnAgCu solder doped with minor Ni
Hsi-Kuei Cheng, Chin-Wen Huang, Hsuan Lee et al. · Journal of Alloys and Compounds · 2014 · 47 citations
Natural Sciences, Materials Engineering, Materials Science +13
Effects of Cu Electroplating Formulas on the Interfacial Microstructures of Sn/Cu Joints
Tai-Yi Yu, Hsuan Lee, Hsuan-Ling Hsu et al. · Journal of The Electrochemical Society · 2016 · 44 citations
Natural Sciences, Materials Engineering, Materials Science +17
Impurity Incorporation in the Cu Electrodeposit and Its Effects on the Microstructural Evolution of the Sn/Cu Solder Joints
Hsuan Lee, Tai-Yi Yu, Hsi-Kuei Cheng et al. · Journal of The Electrochemical Society · 2017 · 28 citations
Microstructural Evolution of Cu/Solder/Cu Pillar-Type Structures with Different Diffusion Barriers
Hsi-Kuei Cheng, Yu‐Jie Lin, Chih‐Ming Chen et al. · Metallurgical and Materials Transactions A · 2016 · 20 citations
Natural Sciences, Materials Engineering, Materials Science +16
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