Bau‐Tong Dai - Concepedia

Author

Bau‐Tong Dai

National Institutes of Applied Research

Also Known As

Bau-Tong Dai, Bau-Tong dai, Bautong Dai, Bau‐Tong Dai

112

Publications

1.7K

Citations

H-Index

Concepts

All Affiliations

National Institutes of Applied Research National Yang Ming Chiao Tung University National Tsing Hua University National Cheng Kung University Kanto Chemical (Japan)

About

Bau‐Tong Dai is an author at National Institutes of Applied Research specializing in engineering, materials science, and applied physics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	22	47	1.4K
2	Applied Physics	18	32	864
3	Chemical Engineering	13	19	545
4	Chemistry	13	14	447
5	Natural Sciences	1	1	37

Bau‐Tong Dai

Publications

1.5K

Citations

H-Index

Page 1

	Year	Citations
Modeling of the Wear Mechanism during Chemical‐Mechanical Polishing Chi‐Wen Liu, Bau‐Tong Dai, Wei‐Tsu Tseng, Journal of The Electrochemical Society Materials ScienceElastic TheoryEngineeringWear MechanismMechanical Properties	1996	99
Near-infrared femtosecond laser-induced crystallization of amorphous silicon Jia‐Min Shieh, Zun-Hao Chen, Bau‐Tong Dai, Applied Physics Letters Optical MaterialsEngineeringLaser ApplicationsLaser MaterialSilicon On Insulator	2004	95
Post-Cu CMP cleaning for colloidal silica abrasive removal Po‐Lin Chen, Jyh‐Herng Chen, Ming‐Shih Tsai, Microelectronic Engineering Extractive MetallurgyChemical EngineeringChemisorptionWater TreatmentAdsorption	2004	76
Microwave Heating for the Preparation of Nanometer Gold Particles Fu-Ken Liu, C.-J. Ker, Yu‐Cheng Chang, Japanese Journal of Applied Physics Materials ScienceNanoparticlesChemical EngineeringEngineeringNanocluster	2003	75
Sol–gel synthesis and the luminescent properties of CaNb2O6 phosphor powders Yu‐Jen Hsiao, Chien-Wei Liu, Bau‐Tong Dai, Journal of Alloys and Compounds Materials ScienceEngineeringSol–gel SynthesisNanomaterialsLuminescent Glass	2008	73
The Effect of Plating Current Densities on Self-Annealing Behaviors of Electroplated Copper Films Shih-Chieh Chang, Jia‐Min Shieh, Bau‐Tong Dai, Journal of The Electrochemical Society EngineeringElectrode-electrolyte InterfaceElectroplated Copper FilmsChemical DepositionCurrent Densities	2002	67
Chemical Mechanical Polishing of Low‐Dielectric‐Constant Polymers: Hydrogen Silsesquioxane and Methyl Silsesquioxane Wen‐Chang Chen, Shu‐Chun Lin, Bau‐Tong Dai, Journal of The Electrochemical Society EngineeringMechanical EngineeringSurface NanotechnologyChemistryPolymers	1999	64
Rapid fabrication of high quality self-assembled nanometer gold particles by spin coating method Fu‐Ken Liu, Yu‐Cheng Chang, Fu‐Hsiang Ko, Microelectronic Engineering Materials ScienceSpin Coating MethodRapid FabricationEngineeringMicrofabrication	2003	63
p-Cu2O-shell/n-TiO2-nanowire-core heterostucture photodiodes Tsung-Ying Tsai, Shoou‐Jinn Chang, Ting‐Jen Hsueh, Nanoscale Research Letters	2011	55
Fast programming metal-gate Si quantum dot nonvolatile memory using green nanosecond laser spike annealing Yu-Chung Lien, Jia‐Min Shieh, Wen-Hsien Huang, Applied Physics Letters Non-volatile MemoryEngineeringEmerging Memory TechnologySelective Source/drain ActivationOptoelectronic Devices	2012	44

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