Wei‐Tsu Tseng

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Publications

Citations

1.1K

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Active since

1996

Affiliations

National Yang Ming Chiao Tung University(Current)

National Cheng Kung University

National Institutes of Applied Research

IBM (United States)

GlobalFoundries (United States)

Wei‐Tsu Tseng is an author at National Yang Ming Chiao Tung University specializing in materials science, materials engineering, and natural sciences.

ORCID

Publications per year

1996–2017

Publications

Re‐examination of Pressure and Speed Dependences of Removal Rate during Chemical‐Mechanical Polishing Processes

Wei‐Tsu Tseng, Ying‐Lang Wang · Journal of The Electrochemical Society · 1997 · 146 citations

Natural Sciences, Materials Engineering, Materials Science +14

Comparison of Cu electromigration lifetime in Cu interconnects coated with various caps

C.‐K. Hu, L. Gignac, E. Liniger et al. · Applied Physics Letters · 2003 · 108 citations

Natural Sciences, Electrical Engineering, Materials Science +16

Modeling of the Wear Mechanism during Chemical‐Mechanical Polishing

Chi‐Wen Liu, Bau‐Tong Dai, Wei‐Tsu Tseng et al. · Journal of The Electrochemical Society · 1996 · 100 citations

Natural Sciences, Materials Engineering, Materials Science +17

A Comparative Study on the Roles of Velocity in the Material Removal Rate during Chemical Mechanical Polishing

Wei‐Tsu Tseng, Jyh‐Hwa Chin, Lee‐Chieh Kang · Journal of The Electrochemical Society · 1999 · 74 citations

Engineering, Materials Engineering, Materials Science +12

Effects of corrosion environments on the surface finishing of copper chemical mechanical polishing

M.T Wang, M. S. Tsai, C Liu et al. · Thin Solid Films · 1997 · 56 citations

Engineering, Materials Engineering, Materials Science +16

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