Concepedia

Wei‐Tsu Tseng

WT

Statistics

Publications

30

Citations

1.1K

H-Index

18

Active since

1996

Affiliations

National Yang Ming Chiao Tung University(Current)

National Cheng Kung University

National Institutes of Applied Research

IBM (United States)

GlobalFoundries (United States)

Wei‐Tsu Tseng is an author at National Yang Ming Chiao Tung University specializing in engineering, materials science, and applied physics.

Top concepts

EngineeringMaterial ScienceChemical EngineeringApplied PhysicsSurface ScienceMechanical EngineeringMicroelectronicsMaterials EngineeringElectrical EngineeringCorrosion

Publications per year

1996–2017

30

Publications

30

Re‐examination of Pressure and Speed Dependences of Removal Rate during Chemical‐Mechanical Polishing Processes

Wei‐Tsu Tseng, Ying‐Lang Wang · Journal of The Electrochemical Society · 1997 · 143 citations

Materials Science, Preston Equation, Chemical Engineering +14

Comparison of Cu electromigration lifetime in Cu interconnects coated with various caps

C.‐K. Hu, L. Gignac, E. Liniger et al. · Applied Physics Letters · 2003 · 108 citations

Engineering, Advanced Packaging (Semiconductors), Corrosion +17

Modeling of the Wear Mechanism during Chemical‐Mechanical Polishing

Chi‐Wen Liu, Bau‐Tong Dai, Wei‐Tsu Tseng et al. · Journal of The Electrochemical Society · 1996 · 99 citations

Materials Science, Elastic Theory, Engineering +14

A Comparative Study on the Roles of Velocity in the Material Removal Rate during Chemical Mechanical Polishing

Wei‐Tsu Tseng, Jyh‐Hwa Chin, Lee‐Chieh Kang · Journal of The Electrochemical Society · 1999 · 73 citations

Engineering, Mechanical Engineering, Material Removal Rate +21

Effects of corrosion environments on the surface finishing of copper chemical mechanical polishing

M.T Wang, M. S. Tsai, C Liu et al. · Thin Solid Films · 1997 · 56 citations

Materials Science, Chemical Engineering, Corrosion Protection +9

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