M. S. Tsai

Effects of kinematic variables on nonuniformity in chemical mechanical planarization

H. Hocheng, Han-Hao Tsai, M. S. Tsai · International Journal of Machine Tools and Manufacture · 2000 · 89 citations

Engineering, Chemical Engineering, Chemistry +8

Effects of corrosion environments on the surface finishing of copper chemical mechanical polishing

M.T Wang, M. S. Tsai, C Liu et al. · Thin Solid Films · 1997 · 56 citations

Engineering, Materials Engineering, Materials Science +16

Nitric acid-based slurry with citric acid as an inhibitor for copper chemical mechanical polishing

Tien Hu, Shao-Yu Chiu, B. T. Dai et al. · Materials Chemistry and Physics · 1999 · 42 citations

Engineering, Materials Engineering, Materials Science +13

Characterization of titanium nitride etch rate and selectivity to silicon dioxide in a Cl2 helicon-wave plasma

Hsien-Ming Chiu, Tsang‐Lang Lin, Yuan Hu et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 2001 · 26 citations

Natural Sciences, Materials Engineering, Materials Science +16

Chemical-mechanical polishing of low-dielectric-constant spin-on-glasses: film chemistries, slurry formulation and polish selectivity

Yu‐Young Wang, C Liu, Shuwen Chang et al. · Thin Solid Films · 1997 · 22 citations

Natural Sciences, Materials Engineering, Materials Science +13