2012 · 10 citations · 3 references
EngineeringElectrical EngineeringElectronic MaterialsMicroelectronicsSemiconductor DevicesCarrier TransportDevice CharacterizationDevice ModelingDevice ReliabilityMetal-oxide-semiconductor Field-effect TransistorsSemiconductor ReliabilityCmos ReliabilityDegradationDevice DegradationGate Oxide ReliabilityHot Carrier EffectsHot Carrier InjectionHot-carrier DegradationReliability Degradation Mechanisms
For the first time, a new decoupling method of PBTI component from hot-carrier (HC) stress is proposed. It is found that the HC degradation is contributed from both PBTI and intrinsic HC component. Using the power-law time exponent of Vt shift in PBTI and HC, the intrinsic HC degradation can be extracted. In addition, a physical model for HC degradation in high-k/metal gate (HK/MG) device has been suggested.
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Barry M. Doyle, Marc Bourcerie, J.-C. Marchetaux et al. · IEEE Transactions on Electron Devices · 1990 · 237 citations
BTI reliability of 45 nm high-K + metal-gate process technology
Sangwoo Pae, M. Agostinelli, M. Brazier et al. · 2008 · 131 citations