Board level investigation of BGA solder joint deformation strength

Combining vibration test with finite element analysis for the fatigue life estimation of PBGA components

Y.S. Chen, C.S. Wang, Youshe Yang · Microelectronics Reliability · 2008 · 110 citations

Engineering, Materials Engineering, Materials Science +17

Design for lead‐free solder joint reliability of high‐density packages

John H. Lau, Walter Dauksher, Joe Smetana et al. · Soldering and Surface Mount Technology · 2004 · 58 citations

Natural Sciences, Materials Engineering, Materials Science +15

Mechanical cycling fatigue of PBGA package interconnects

Larry Leicht, Andrew Skipor · Microelectronics Reliability · 2000 · 47 citations

Natural Sciences, Materials Engineering, Materials Science +14

Integrated numerical–experimental analysis of interfacial fatigue fracture in SnAgCu solder joints

M. Erinç, P.J.G. Schreurs, M.G.D. Geers · International Journal of Solids and Structures · 2007 · 43 citations · Full text

Engineering, Materials Engineering, Materials Science +15

Study of micro-BGA solder joint reliability

P.L. Tu, Y.C. Chan, K.C. Hung et al. · Microelectronics Reliability · 2001 · 41 citations

Engineering, Electrical Engineering, Electronic Materials +11