Study of micro-BGA solder joint reliability

Effect of intermetallic compounds on the thermal fatigue of surface mount solder joints

P.L. Tu, Y.C. Chan, J.K.L. Lai · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1997 · 150 citations

Natural Sciences, Materials Engineering, Materials Science +17

Growth kinetics of intermetallic compounds in chip scale package solder joint

P.L. Tu, Y.C. Chan, K.C. Hung et al. · Scripta Materialia · 2001 · 140 citations

Natural Sciences, Materials Engineering, Materials Science +13

Effect of intermetallic compounds on the shear fatigue of Cu/63Sn-37Pb solder joints

Y.C. Chan, P.L. Tu, A.C.K. So et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1997 · 67 citations

Natural Sciences, Materials Engineering, Materials Science +17

Intermetallic compound growth on Ni, Au/Ni, and Pd/Ni substrates with Sn/Pb, Sn/Ag, and Sn solders [PWBs]

H.D. Blair, Tsung‐Yu Pan, J.M. Nicholson · 2002 · 46 citations

Natural Sciences, Materials Engineering, Materials Science +14

Board level reliability of CSP

Hiroyuki Juso, Yasuhisa Yamaji, Takeshi Kimura et al. · 2002 · 43 citations

Engineering, Manufacturing Engineering, Materials Science +14