Tsung‐Yu Pan

High temperature lead-free solder for microelectronics

Frank W. Gayle, G.A. Becka, Ahmer Syed et al. · JOM · 2001 · 72 citations

Materials Science, Electrical Engineering, Engineering +6

Thermal Cycling Induced Plastic Deformation in Solder Joints—Part I: Accumulated Deformation in Surface Mount Joints

Tsung‐Yu Pan · Journal of Electronic Packaging · 1991 · 72 citations

Engineering, Severe Plastic Deformation, Mechanical Engineering +17

Study of mechanical joint strength of aluminum alloy 7075-T6 and dual phase steel 980 welded by friction bit joining and weld-bonding under corrosion medium

Yong Chae Lim, Lile Squires, Tsung‐Yu Pan et al. · Materials & Design (1980-2015) · 2014 · 54 citations · Full text

Materials Science, Corrosion Medium, Engineering +10

Critical Accumulated Strain Energy (Case) Failure Criterion for Thermal Cycling Fatigue of Solder Joints

Tsung‐Yu Pan · Journal of Electronic Packaging · 1994 · 51 citations

Engineering, Mechanical Engineering, Fatigue +21

Intermetallic compound growth on Ni, Au/Ni, and Pd/Ni substrates with Sn/Pb, Sn/Ag, and Sn solders [PWBs]

H.D. Blair, Tsung‐Yu Pan, J.M. Nicholson · 2002 · 46 citations

Materials Engineering, Materials Science, Chemical Engineering +14