Journal of Applied Physics · 2007 · 10 citations · 14 references
EngineeringElectrical EngineeringMaterials ScienceElectronic MaterialsMicroelectronicsSemiconductor DevicesCarrier TransportDevice CharacterizationDevice SimulationField-effect TransistorsSemiconductor InterfacesSemiconductor PhysicsDopant ImplantationDopant IncorporationField-effect Transistor SimulationFin Field-effect TransistorsFin StructureMicroscopyScanning Capacitance MicroscopySemiconductor Doping Profiles
Scanning capacitance microscopy studies of processed fin structures for fin field-effect transistor (FinFET) are presented. We characterized carrier profiling of fins as a function of implantation conditions. The results are confirmed by high angle annular dark field transmission electron microscopy study and qualitatively agree with simulations. The techniques we report can be used in conjunction with implantation and simulation to characterize the dopant profile of FinFET structures and further optimize FinFET processing parameters.
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FinFET-a self-aligned double-gate MOSFET scalable to 20 nm
Chenming Hu, Jeffrey Bokor, Tsu‐Jae King et al. · IEEE Transactions on Electron Devices · 2000 · 1.6K citations
Engineering, Electrical Engineering, Electronic Materials +13