Diffusion barrier properties of nano-crystalline TiZrN films in Cu/Si contact systems

Comparison of the diffusion barrier properties of chemical-vapor-deposited TaN and sputtered TaN between Cu and Si

Mei‐Hui Tsai, Shuo Sun, C.E. Tsai et al. · Journal of Applied Physics · 1996 · 174 citations

Natural Sciences, Materials Engineering, Materials Science +17

Evaluation of amorphous (Mo, Ta, W)SiN diffusion barriers for 〈Si〉|Cu metallizations

J.S. Reid, E. Kolawa, R. Ruiz et al. · Thin Solid Films · 1993 · 165 citations

Natural Sciences, Materials Engineering, Materials Science +12

Properties of reactively sputter-deposited TaN thin films

Xin Sun, Elzbieta Kolawa, Jen‐Sue Chen et al. · Thin Solid Films · 1993 · 135 citations

Natural Sciences, Materials Engineering, Materials Science +11

Effects of oxygen in TiN<i>x</i> on the diffusion of Cu in Cu/TiN/Al and Cu/TiN<i>x</i>/Si structures

J. O. Olowolafe, Jian Li, J. W. Mayer et al. · Applied Physics Letters · 1991 · 114 citations

Natural Sciences, Materials Engineering, Materials Science +12

Properties of TaN<i>x</i> films as diffusion barriers in the thermally stable Cu/Si contact systems

Mayumi B. Takeyama, Atsushi Noya, Touko Sase et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 1996 · 114 citations

Natural Sciences, Materials Engineering, Materials Science +17