Journal of Applied Physics · 2007 · 29 citations · 15 references
EngineeringMaterials EngineeringMaterials ScienceCondensed Matter PhysicsSemiconductor DevicesSemiconductor MaterialsScanning Probe MicroscopySemiconductor DefectsSemiconductor Device MaterialsSemiconductor InterfacesSemiconductor PhysicsSemiconductor SurfacesAnnealing Temperature EffectsCapacitanceCharge TrappingGate Oxide InterfacesInterface Trap DensityInterface Trap StatesScanning Capacitance MicroscopyTrap Characterization
We studied the oxide charges and traps within nitrided Hf-silicate (HfSiON)∕SiO2 gate stacks processed with high-temperature annealing with a spectroscopic technique by using high spatial resolution scanning capacitance microscopy. Spectroscopy was performed by detecting the static capacitance (dC∕dZ) between a conductive probe and the sample while sweeping the sample bias. The dC∕dZ image and spatially resolved dC∕dZ-V spectrum revealed the existence of positive fixed charges within HfSiON and interface trap charges between the SiO2 underlayer and Si substrate. We also observed a transient electron trap process from the conductive probe to the HfSiON film as abrupt discontinuities in the dC∕dZ-V spectrum and with bias-induced topography change of the HfSiON surface. These oxide charges and trap sites distribute inhomogeneously within HfSiON∕SiO2 gate stacks, and the origin of these charged defects is ascribable to phase separation induced by high-temperature postdeposition annealing.
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