JSTS Journal of Semiconductor Technology and Science · 2012 · 95 citations · 18 references
EngineeringElectrical EngineeringMaterials ScienceMicroelectronicsSemiconductor DevicesSemiconductor MaterialsDevice CharacterizationDevice ModelingIntegrated Circuit DesignMetal-oxide-semiconductor Field-effect TransistorsP-n JunctionsSemiconductor InterfacesAmbipolar TransportCapacitanceChannel Doping EffectsGate Dielectric Engineering
In the present work, comprehensive investigation of the ambipolar characteristics of two silicon (Si) tunnel field-effect transistor (TFET) architectures (i.e. p-i-n and p-n-p-n) has been carried out. The impact of architectural modifications such as heterogeneous gate (HG) dielectric, gate drain underlap (GDU) and asymmetric source/drain doping on the ambipolar behavior is quantified in terms of physical parameters proposed for ambipolarity characterization. Moreover, the impact on the miller capacitance is also taken into consideration since ambipolarity is directly related to reliable logic circuit operation and miller capacitance is related to circuit performance.
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Tunnel field-effect transistor without gate-drain overlap
Anne S. Verhulst, William G. Vandenberghe, Karen Maex et al. · Applied Physics Letters · 2007 · 432 citations · Full text